Integration of LD and optical isolator by using heterogeneous wafer bonding

Heterogeneous Photonic Integration by Direct Wafer Bonding

The silicon (Si) photonics platform has emerged as a promising integration platform for use in many applications, particularly datacenter communications, which is expected to produce demand for large numbers of low cost photonic integrated circuits (PICs). Sibased PICs are almost universally based on Si-on-insulator (SOI) wafers, which are enabled by wafer bonding technology. Si is useful as a ...

Copper wafer bonding in three-dimensional integration

Wafer-level heterogeneous integration of MEMS actuators

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The Role of Wafer Bonding in 3D Integration and Packaging

There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for...

control of the optical properties of nanoparticles by laser fields

در این پایان نامه، درهمتنیدگی بین یک سیستم نقطه کوانتومی دوگانه(مولکول نقطه کوانتومی) و میدان مورد مطالعه قرار گرفته است. از آنتروپی ون نیومن به عنوان ابزاری برای بررسی درهمتنیدگی بین اتم و میدان استفاده شده و تاثیر پارامترهای مختلف، نظیر تونل زنی(که توسط تغییر ولتاژ ایجاد می شود)، شدت میدان و نسبت دو گسیل خودبخودی بر رفتار درجه درهمتنیدگی سیستم بررسی شده اشت.با تغییر هر یک از این پارامترها، در...